High power (160 W) handling in a small package (TO-3P), for minimized heat sink requirements
Built-in drivers and temperature compensation diodes, reducing external component count and simplifying circuit design
Emitter terminals placed symmetrically on NPN and on PNP models, allowing adjacent placement on PCB to minimize trace length and output skew when used in pairs.
High power (160 W) handling in a small package (TO-3P), for minimized heat sink requirements
Built-in drivers and temperature compensation diodes, reducing external component count and simplifying circuit design
Emitter terminals placed symmetrically on NPN and on PNP models, allowing adjacent placement on PCB to minimize trace length and output skew when used in pairs.
